关键词:
SiC MOSFETs
short-circuit withstand time
high-frequency figure of merit (HF-FOM)
device reliability
摘要:
In this letter, a novel Split-Gate SiC MOSFET is proposed by introducing a P+ buffer (SG-PB-MOS) into the JFET region. The P+ buffer serves to enhance device oxide reliability by mitigating the peak oxide electric field (E-max) . Besides, the P+ buffer facilitates depletion of the JFET region under high drain voltage, suppressing the short-circuit current. The SG-PB-MOS, Split-Gate MOSFET (SG-MOS), and conventional MOSFET (C-MOS) are systematically characterized through TCAD simulations. Cell-level parameter distributions are observed and analyzed to validate the efficacy of the proposed structure. In blocking states, the SG-PB-MOS demonstrates the mildest Emax . Moreover, compared to the C-MOS and SG-MOS, the SG-PB-MOS exhibits a 1.5x and 2.1x improvement in short-circuit withstand time (SCWT), a 5.2x and 2.4x improvement in high-frequency figure-of-merit (HF-FOM, R-on x Q(gd)) , respectively. Notably, these enhancements are achieved with negligible impact on R-on. As a result, SG-PB-MOSFET shows superior trade-offs in both R-on & E-max, Ron & SCWT, and R-on & Q(gd), making it suitable for high reliability and high power-density applications.