摘要:
As metal-oxide-semiconductor field-effect transistors (MOSFETs) devices approach their dimensional scaling limits, 3D structures such as gate-all-around FETs (GAAFETs) have been introduced to improve the electrical characteristics of transistors by increasing the effective channel width. In modern logic devices with a GAA structure, in-situ doped epitaxial silicon is grown on recessed source/drain (S/D) regions using selective epitaxial growth (SEG) process. However, the SEG process poses a competitive disadvantage in terms of complexity and cost. To simplify the integration process, we propose a method for forming S/D without relying on SEG. In this study, we investigate the formation of S/D using nanosecond laser annealing process in devices with multilayer channels. Three pairs of Si/Si0.7Ge0.3 multilayer films were deposited on Si (100) substrates using ultra-high vacuum chemical vapor deposition (UHVCVD). After deposition, boron and phosphorus dopants were implanted into the structure. Samples were then subjected to nanosecond laser annealing under various conditions using a krypton fluoride (KrF) pulse laser. Finally, we obtained recrystallized and doped films that function as S/D. Transmission electron microscopy (TEM) confirmed the microstructure of recrystallized films as function of increasing laser power density. Additionally, the dopant distribution was analyzed using secondary ion mass spectrometry (SIMS). High resolution X-ray diffraction (HR-XRD) was employed to examine the strain behavior in the films. Results indicate that the nanosecond laser annealing process is a viable method for forming S/D in devices with Si/SiGe multilayer channels.
Acknowledgements
This work was supported by the Joint Program for Samsung Electronics at Yonsei University and the Technology Innovation Program (20010598) funded by the Ministry of Trade, Industry & Energy (MOTIE).