关键词:
Loop thermosyphon
Vertical flat plate evaporator
Filling ratio
Heat load
Instability
摘要:
As a key component of new energy conversion systems and high voltage power supply switching devices, effective heat dissipation will greatly improve its service life and operational stability. Loop thermosyphon is an efficient two-phase heat transfer device. It has no internal moving parts, consumes no external energy, and can transfer heat over long distances. These advantages enable it to solve the IGBT heat dissipation problem. However, the research on the application of loop thermosyphon to vertical working IGBTs, which requires the arrangement of vertical flat evaporators and high-temperature uniformity, is not sufficient. In this paper, a loop thermosyphon with a vertical flat evaporator is designed and tested. Thus, various important influencing factors, such as filling ratios (31 %-87 %), heat loads (100 W-900 W), and cooling water temperatures (10 degrees C-40 degrees C), on the heat transfer capacity of the loop thermosyphon and temperature uniformity of the evaporator were studied. The experimental results show that the optimal filling ratio is 52 %, which is the result of combining the maximum temperature and temperature uniformity of the evaporator substrate. When Q = 500 w, the maximum temperature (Te1 = 52 degrees C) remains unchanged between 37 % and 52 %. Increasing the filling ratio can improve the temperature uniformity. At the same time, when Q = 600 W, the top of the evaporator appears to have a dry- up phenomenon, which is the main reason for the deterioration of temperature uniformity. Increasing the filling ratio or decreasing the heat load can effectively solve this problem. Meanwhile, through the internal pressure and mass flow rate changes of the system, the variation law of mass flow rate under different experimental conditions is summarized. In addition, the instability of loop thermosyphon under different heat loads and different cooling water temperatures is analyzed.