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关键词： Bond wire   Solder layer   Insulated gate bipolar transistor (IGBT)   Electrical-thermal-mechanical multi-physical   field coupling  

摘要： As the key package structure of insulated gate bipolar transistor (IGBT), the bond wire and solder layer are susceptible to failure due to alternating thermal stress, which can seriously change the operating characteristics of the package structure. In this paper, an electrical-thermal-mechanical multi-physical field coupling simulation model of IGBT including the fine bond wire and solder layer structure is constructed, whose equivalence and accuracy are verified by experiments and characteristic curves. Based on the constructed healthy model, the simulation results find that the fourth bond wire at the center location shows the highest temperature of 38.7 degrees C and the maximum mechanical stress of 55.5 MPa. Subsequently, the researches on single-structure failure and dual-structure simultaneous failure are carried out. The results show that bond wire failure only significantly affects its own operating characteristics, while solder layer failure affects itself and bond wire simultaneously. Moreover, the temperature rise due to the bond wire failure is more significant with an 86.8 % increase, while the mechanical stress change due to the solder layer failure is larger with a 178.2 % increase. The research in this paper can guide the reliability improvement of IGBT and the optimization of IGBT package structure.

关键词： IGBT module   Vibration   Multi-physics simulation   Solder layer fatigue  

摘要： Insulated-gate bipolar transistor (IGBT) modules are extensively utilized in high-speed trains, ships, and electric vehicles. Compared to those used in power systems, IGBT modules in these applications are more susceptible to vibration effects on their reliability. This paper proposes a multi-physics field simulation method and a lifetime model for IGBT modules to assess the impact of different vibration directions on solder layer fatigue. Initially, a multi-physics field model of the IGBT module is developed, incorporating electrical, thermal, mechanical, and vibration coupling. The effectiveness of this multi-physics simulation model is verified by an experimental platform. Subsequently, the influence of different vibration directions on solder layer fatigue in the IGBT module is analysed, and a life model of the IGBT is proposed through simulation. Finally, a power cycling with a vibration environment experimental platform is established to validate the effect of vibration on solder layer fatigue in the IGBT module. The simulation and experimental results indicate that vertical vibration accelerates the solder layer fatigue of IGBT modules, and the lifetime of an IGBT module operating under vertical vibration at 30 Hz is about 15 % shorter than that of an IGBT module operating under power cycling alone. The error between the calculated results of the solder layer failure and the experimental result is <5 %.

关键词： 永磁同步电机   自抗扰控制,超螺旋滑模控制   矢量控制  

摘要： 为了提高永磁同步电机矢量控制性能，解决传统比例积分（proportional integral，PI）控制超调，抗干扰能力不足的问题，提出了自抗扰速度控制器和改进超螺旋滑模电流控制器。在转速环中引入非线性误差控制率和扩张状态观测器，提升自抗扰响应速度和抗干扰能力；在电流环中引入改进的超螺旋滑模控制，提高了永磁同步电机响应的快速性和电流品质。搭建永磁同步电机自抗扰控制和超螺旋滑模控制相结合的仿真模型，在仿真结果中实现了快速跟踪阶跃信号，电流波动小，系统出现扰动时，电机的转速和转矩波动较小，迅速恢复稳定，提高了系统的鲁棒性和动态性能。

关键词： 故障诊断   IGBT   间歇开路故障   因果卷积   残差神经网络  

摘要： 针对地铁列车牵引逆变器中绝缘栅双极性晶体管（Insulated Gate Bipolar Transistor， IGBT）间歇开路故障的隐蔽性和传播性，提出一种内涵因果分析的Causal-Res故障诊断方法。首先深入挖掘逆变器输出三相电流信号之间的潜在因果关系，利用时间卷积网络（Temporal Convolutional Network， TCN）中的因果卷积机制，构造能够表征IGBT间歇开路故障特性的特征向量，然后结合残差神经网络（Residual Neural Network）特征学习能力对故障特征向量分类实现故障诊断。试验结果表明，提出的方法在IGBT低概率和高概率发生间歇开路故障的场景下，其定位故障IGBT的准确率分别为99.99%和99.95%，对比试验也说明了因果关系的引入能有效提高诊断方法的准确率和稳定性。

标准号: GB/T 44802-2024

摘要： 本文件规定了柔性直流输电用绝缘栅双极晶体管驱动器的术语和定义、使用条件、总体要求、主要参数选取、技术要求、试验以及包装、标志、运输和贮存。本文件适用于±800 kV及以下采用模块化多电平换流器技术的柔性直流输电用绝缘栅双极晶体管驱动器，基于其他换流器拓扑的电力电子设备用绝缘栅双极晶体管驱动器参照使用。

关键词： 无约束椭圆最优控制问题   稳定化混合有限元   低次等阶有限元对   误差估计  

摘要： 采用低次等阶混合元结合局部高斯积分稳定化方法求解无约束椭圆最优控制问题。首先，结合变分原理和最优化理论，将求解椭圆最优控制问题转化为状态方程、对偶方程和最优性条件三者的联立系统。其次，构造椭圆最优控制问题的稳定化混合元格式，并分析该格式的误差估计。最后，通过数值算例验证格式的有效性。

关键词： T型三电平逆变器   永磁伺服电机   直接转矩控制   零序电压   中点电位平衡  

摘要： 为了解决T型三电平逆变器供电的三相永磁伺服电动机驱动系统的电容电压不平衡问题，本文提出一种基于零序电压注入的载波调制直接转矩控制策略。首先，通过电机模型计算完成了直接转矩控制策略的构建。其次，由预期电压值进行坐标变换得到参与PWM控制的调制电压，实现了载波调制与直接转矩控制结合。最后，为了实现中点电位的平衡控制，根据上下电容电压的采样差值计算和校正注入的零序电压值。实验结果表明，所提控制策略能够有效实现转矩脉动的减小和中点电压的平衡控制。