摘要:
This investigation identifies the critical solder joint in a typical Insulated Gate Bipolar Transistor (IGBT) module and provided new knowledge on how operating thermal loads degrade IGBT-attach, Diode-attach, and Substrate solder joints in the device. SolidWorks software is used to create three realistic 3-D Finite Element (FE) models of the typical IGBT module used in this investigation. In-service operating power and IEC 60068-2-14 thermal cycles are implemented in ANSYS mechanical package to simulate the response of the three solder joints in the FE models to the load cycles. The solder in the joints is lead-free alloy of 96.5% tin, 3% silver, and 0.5% copper (SAC305) composition. The SAC305 material properties are modelled as time and temperature dependent with Anand's visco-plastic model employed as the constitutive model. Results show that the key degradation mechanism of solder joints in IGBT module are stress, plastic strain, and strain energy magnitudes. Accumulated plastic strain in the joints is found the predominant damage factor. Critical solder joint in the module depends on the load cycle the device experiences. IGBT-attach solder joint is critical in active power load cycle. Substrate solder joint degraded most in passive thermal cum combined passive thermal and active power load cycles.
摘要:
在电动汽车无线充电系统中,负载锂电池的充电过程为先恒流再恒压,因此,无线电能传输(wireless power transfer,WPT)系统需要同时具备实现双输出的能力,且在双输出状态之间进行平稳切换。基于此,分析双边LCC(inductor-capacitor-capacitor)拓扑实现与负载无关的恒流/恒压输出条件,给出参数设计方法。针对系统可能会随机在不同方向上出现位移的情况,采用了双向同轴平面线圈的结构,即原边线圈由内外2个沿相反方向绕制的线圈串联组成。通过仿真和实验验证了本文提出的电动汽车无线充电系统具备同时实现恒流/恒压输出的能力,且在多方向偏移工况下实现稳定输出。